Electrocaloric cooling over high device temperature span

Conventional cooling method consumes large amount of electricity and heavily relies on hydrofluorocarbon coolants, which are considered “super-greenhouse effect” gases. Electrocaloric (EC) demonstrates high energy efficiency, involves no evaporative coolant, is a promising next-generation technology. A safe operational temperature change the EC material currently limited to well below 10 K, devices for practical application scenarios need be able pump heat at over 20 K. Since 90s, device community has mostly focused fluid-based prototypes that employ an oscillatory moving liquid actively transfer regenerate heat; this approach proved successful in building gradient Recently, few solid-state pumps have emerged featuring direct cascade style. Discussion these two architectures, material, actual manufacture challenges should broad interest design efficient compact systems. utilization often proposed as environmentally benign, alternative conventional vapor compression As result, fabrication effective electrocaloric materials engineering attracted increasing attention community. However, adiabatic under operation field poses major challenge development, since real-world applications usually require span This perspective presents recent efforts devoted based active regeneration cascading approaches; both strategies achieved significant lift ~10 K with 2~3 The discussed work broadly applicable ubiquitous (VCC) technology been long criticized its release gases aggravates disastrous global warming, difficulty scale down individual personal or device-level cooling.1Shi J.Y. Han D.L. Li Z.C. Yang L. Lu S.G. Zhong Z.F. Chen J.P. Zhang Q.M. 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